NDLI: Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints

Content Provider	Springer Nature Link
Author	Kim, Yang Ho Ma, Sung Woo Kim, Young Ho
Copyright Year	2014
Abstract	Chip to chip bonding techniques using Cu bumps capped with thin solder layers have been frequently applied to 3D chip stacking technology. We studied the effect of joint microstructure on shear strength. Joints were formed by joining Sn/Cu bumps on a Si die and Sn/Cu layers on another Si die at 245–330°C using a thermo-compression bonder. Three different types of microstructures were fabricated in the joints by controlling the bonding temperature and time, (1) a Sn-rich phase with a Cu$_{6}$Sn$_{5}$ phase at the Cu interfaces, (2) a Cu$_{6}$Sn$_{5}$ phase in the interior with a Cu$_{3}$Sn phase at the Cu interfaces, and (3) one single Cu$_{3}$Sn phase throughout the whole joint. The joint having a single Cu$_{3}$Sn phase had the highest shear strength. Specimens were aged up to 2000 h at 150°C and 180°C. During aging, the microstructures of all joints were transformed in a single Cu$_{3}$Sn phase. The shear strength of the joints was very sensitive to the formation of Cu$_{3}$Sn and microvoids. Microvoids formed in the solder joints with a Cu$_{6}$Sn$_{5}$ phase with and without a Sn-rich phase during aging and decreased the shear strength of the joints. Conversely, aging did not induce the formation of microvoids in the joints which originally had only a Cu$_{3}$Sn phase and the shear strength was not decreased.
Starting Page	3296
Ending Page	3306
Page Count	11
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	43
Issue Number	9
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2014-05-24
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Sn/Cu bumps thin capping layer joint microstructure shear test aging treatment Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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