NDLI: Recent advances and trend of HEV/EV-oriented power semiconductors

Content Provider	IET Digital Library
Author	Liu, Guoyou Li, Kongjing Wang, Yangang Luo, Haihui Luo, Haoze
Abstract	This study introduces the development advances and trend of power semiconductors used in hybrid and electric vehicles (HEV/EV). The status and forecast of power electronics’ requirement in HEV/EV are discussed along with a review of the automotive standard of power semiconductor devices. The advances in automotive semiconductor technologies such as Si-based insulated-gate bipolar transistor (IGBT) and freewheeling diode (FRD) and SiC-based metal oxide semiconductor field-effect transistor (MOSFET) and Schottky barrier diode are presented. The advances in automotive semiconductor packaging technologies are illustrated from three considerations, which are the low inductance in high-power density packaging, lower thermal resistance designing, and advanced packaging technologies. The challenges and development trend of more reliable power semiconductors for HEV/EV are discussed. The challenges in Si devices are focused on power density, efficiency, reliability, and packages, while the high temperature and low inductances are the main challenges for SiC devices. Lastly, the development trend is discussed in terms of four aspects, the new generation Si IGBT for HEV/EV, such as recessed-emitter-trench, reverse-conduction-IGBT, and smart IGBT; next generation SiC MOSFET; new packaging technology and material, such as planar packaging.
Starting Page	394
Ending Page	404
Page Count	11
ISSN	17554535
Volume Number	13
e-ISSN	17554543
Issue Number	Issue 3, Feb (2020)
Alternate Webpage(s)	https://digital-library.theiet.org/content/journals/iet-pel/13/3
Alternate Webpage(s)	https://digital-library.theiet.org/content/journals/10.1049/iet-pel.2019.0401
Journal	IET Power Electronics
Publisher Date	2019-07-26
Access Restriction	Open
Rights Holder	© The Institution of Engineering and Technology
Subject Keyword	Advanced Packaging Technology Automobile Electronics Automotive Electronics Automotive Semiconductor Packaging Technology Automotive Standard Bipolar Transistor Electric Vehicle Elemental Semiconductor FRD HEV-EV-oriented Power SemiConductor High-power Density Packaging Hybrid Electric Vehicle IGBT Insulated Gate Bipolar Transistors Insulated Gate Field Effect Transistors Junction And Barrier Diode Low Inductance Metal Oxide Semiconductor Field-effect Transistor MOSFET Power Density Power Electronics Power Field Effect Transistors Power Semiconductor Device Product Packaging Reliability Reliable Power SemiConductor Schottky Barrier Diode Schottky Barriers Schottky Diode Semiconductor Device Packaging Semiconductor Device Reliability SiC Silicon Silicon Compound Silicon-based Insulated-gate Bipolar Transistor Thermal Resistance Thermal Resistance Design Wide Band Gap SemiConductor
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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