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Content Provider | IET Digital Library |
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Author | Kim, Cheol Ho Park, Bonghyuk |
Abstract | Miniaturised stacked-coil radio-frequency (RF) transformers were fabricated with thick metal layers using the low-cost anodised aluminium substrate process. The transformer consists of a 34 μm-thick substrate-buried copper lower coil and a 30 μm-thick copper/gold upper coil with a 3 μm-thick benzocyclobutene (BCB) interlayer between the coils. Owing to extremely low losses and tight coupling, the fabricated transformers achieved very low insertion losses as low as 0.28 dB and high maximum available gains of up to 0.96 at GHz frequencies. The results verify that the stacked-coil transformer with thick metal layers can be a promising component for high-performance miniaturised RF circuits. |
Starting Page | 1359 |
Ending Page | 1361 |
Page Count | 3 |
ISSN | 00135194 |
Volume Number | 50 |
e-ISSN | 1350911X |
Issue Number | Issue 19, Sep (2014) |
Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/el/50/19 |
Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/el.2014.2502 |
Journal | Electronics Letters |
Access Restriction | Open |
Rights Holder | © The Institution of Engineering and Technology |
Subject Keyword | BCB Interlayer Benzocyclobutene Interlayer Coils Copper-gold Upper Coil High-frequency Transformer High-performance Miniaturised RF Circuit Inductors And Transformer Low-cost Anodised Aluminium Substrate Process Miniaturised Stacked-coil Radio-frequency Transformer Miniaturised Stacked-coil RF Transformer Size 3 Mum Size 34 Mum Substrate-buried Copper Lower Coil Substrate-Down Configuration Thick Metal Layer Thin Film Growth And Epitaxy |
Content Type | Text |
Resource Type | Article |
Subject | Electrical and Electronic Engineering |
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