Please wait, while we are loading the content...
| Content Provider | IET Digital Library |
|---|---|
| Author | Kim, Y. Lee, Jong Hyun Kim, S. M. Rhee, S. I. Song, J. Y. |
| Abstract | The fabrication of a flexible electronic system which consists of a flexible polyimide (PI) substrate and a rigid silicon thin chip is demonstrated. The 50 μm thick rigid silicon chips are bonded to the PI substrate using a die attach film (20 μm) and electrically interconnected to an adjacent metal pad which is deposited on the PI substrate and silicon chips. A 3D step covered interconnection consisted of silver nanoparticles and polymer are achieved by using an electrohydrodynamic system. The mechanical and electrical characteristic was investigated by performing a Kelvin resistance measurement on the jetted lines while the substrate was subjected to bending modes of varying diameters. |
| Starting Page | 1039 |
| Ending Page | 1041 |
| Page Count | 3 |
| ISSN | 00135194 |
| Volume Number | 52 |
| e-ISSN | 1350911X |
| Issue Number | Issue 12, Jun (2016) |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/el/52/12 |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/el.2016.0047 |
| Journal | Electronics Letters |
| Publisher Date | 2016-05-11 |
| Access Restriction | Open |
| Rights Holder | © The Institution of Engineering and Technology |
| Subject Keyword | 3D Step Covered Interconnection Adjacent Metal Pad Damage-free Three-dimensional Step Covered Interconnection Method Die Attach Film Electrical Characteristic Electrohydrodynamic Jetting Electrohydrodynamic System Electrohydrodynamics Elemental Semiconductor Flexible Electronic System Flexible Electronics Flexible Polyimide Substrate Hybrid System in Flexible HySiF Integrated Circuit Interconnections Kelvin Resistance Measurement Mechanical Characteristic Metallisation And Interconnection Technology Microassembling Microassembly Technique Nanoparticle PI Substrate Polymer Rigid Silicon Thin Chip Semiconductor Integrated Circuit Semiconductor Thin Film Silicon Silver NanoParticle Size 20 Mum Size 50 Mum |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|