NDLI: Wafer and/or chip bonding adhesives for 3D package

Content Provider	IEEE Xplore Digital Library
Author	Nonaka, T. Fujimaru, K. Shimada, A. Asahi, N. Tatsuta, Y. Niwa, H. Tachibana, Y.
Copyright Year	2010
Description	Author affiliation: Toray Industries, Inc. 1-2, Sonoyama 3-chome, Otsu, Shiga, 520-0842, Japan (Nonaka, T.; Fujimaru, K.; Shimada, A.; Asahi, N.; Tatsuta, Y.; Niwa, H.; Tachibana, Y.)
Abstract	For 3D package application the demanded feature of chip bonding adhesive was discussed and the material was developed, which was wafer level process compatible NCF (Non conductive sheet). It should be high flowability for lamination on a bumped wafer surface without void, diced with wafer without deformation or sticking dust, transparent for alignment mark detection and low coefficient of thermal expansion (CTE) for the package thermal cycle durability. The nano particle dispersed and highly loaded NCF has been developed to satisfy the demanded characteristics. The CTE was 37°C/ppm and 1% weight loss temperature is higher than 350°C. The photosensitive NCF has been also developed. Bump top adhesive can be removed completely by photolithography before bonding process. It can wipe off the anxiety of adhesive residue between bump and pad. This material is also good for lamination and has high heat resistance of 1% weight loss temperature higher than 300°C.
Starting Page	1
Ending Page	4
File Size	560783
Page Count	4
File Format	PDF
ISBN	9781424475933
e-ISBN	9781424475940
DOI	10.1109/CPMTSYMPJ.2010.5679534
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-08-24
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Viscosity Temperature measurement Lamination Three dimensional displays Bonding
Content Type	Text
Resource Type	Article

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