NDLI: Effects of the crystallographic orientation of Sn grain during electromigration test

Content Provider	IEEE Xplore Digital Library
Author	Kiju Lee Keun-Soo Kim Yamanaka, K. Tsukada, Y. Kuritani, S. Ueshima, M. Suganuma, K.
Copyright Year	2010
Description	Author affiliation: KYOCERA SLC Technologies Co., Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan (Yamanaka, K.) \|\| SENJU METAL INDUSTRY CO., LTD. Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan (Ueshima, M.) \|\| ISIR, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan (Kiju Lee; Keun-Soo Kim; Tsukada, Y.; Suganuma, K.) \|\| ESPEC. CORP, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan (Kuritani, S.)
Abstract	The relationship between electromigration behavior and the crystallographic orientation of Sn grains was investigated. The test vehicle was the Cu/Sn−3.0wt%Ag−0.5wt%Cu/Cu dummy flip-chip model, and the applied current density was 15 $kA/cm^{2}$ at 160 °C. The depletion of Cu atoms at the cathode side is a major cause of the early circuit failure. Electromigration behavior and the growth of intermetallic compounds were strongly depend on the orientation of Sn grains with respect to the electron flow. Rapid failure occurred when the c axis of Sn grains close to the parallel to the direction of the electron flow, due to the Cu depletion at the cathode side. Slight microstructural changes and improved electromigration properties were observed when the c axis of the Sn grains close to perpendicular to the direction of electron flow.
Starting Page	1
Ending Page	4
File Size	477882
Page Count	4
File Format	PDF
ISBN	9781424475933
e-ISBN	9781424475940
DOI	10.1109/CPMTSYMPJ.2010.5679668
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-08-24
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Resistance Electromigration Tin Copper Soldering Cathodes Vehicles
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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