NDLI: Next generation substrate for high density and thin package

Content Provider	IEEE Xplore Digital Library
Author	Furuta, T.
Copyright Year	2010
Description	Author affiliation: IBIDEN Co., LTD., 3-200 Gama-cho Ogaki-city Gifu-prefecture Japan (Furuta, T.)
Abstract	Advancements and reduced geometries in Si development have significantly impacted package substrate technology. In particular, the reduced die size and consumer applications now require higher routing densities, smaller assembly area and an overall thinner profile for package substrates. In support of the high density requirements and general miniaturization trend, a number of packaging solutions have been adopted, including: migration to FC interconnection, and three dimensional packaging structures such as MCP (multi chip package) and POP (package on package). Along with high routing density, thin package reliability requirements remain high and also pose new challenges. Particularly, three dimensional packaging solutions have reduced the threshold for reliability factors such as drop test and warpage. To support these reliability challenges, new surface treatment and substrate material options have been explored. In support of the above mentioned high density and reliability requirements, IBIDEN proposes the FVC (filled via core) substrate structure.
Starting Page	1
Ending Page	4
File Size	441790
Page Count	4
File Format	PDF
ISBN	9781424475933
e-ISBN	9781424475940
DOI	10.1109/CPMTSYMPJ.2010.5679661
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-08-24
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gold Nickel Copper Surface finishing Substrates
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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