NDLI: PoP prototyping by determination of matter transport effects

Content Provider	IEEE Xplore Digital Library
Author	Meinshausen, L. Weide-Zaage, K. Feng, W. Frémont, H.
Copyright Year	2010
Description	Author affiliation: LFI, Leibniz University Hannover, Schneiderberg 32, 30167 Hannover, Germany (Meinshausen, L.; Weide-Zaage, K.) \|\| Laboratoire IMS, Université Bordeaux I (Feng, W.; Frémont, H.)
Abstract	The assemblies “PoP” (Package-on-Package) can significantly increase the integration density of microelectronic circuits and systems, by vertically combining discrete semiconductor elements. Related to reliability especially migration phenomena, which are investigated here by simulation and measurements, become more important as the dimension of bumps decreases. To explore the influence of migration phenomena to the lifetime of PoPs a test card for current stress tests was designed. Furthermore, an exploration IMC growth was carried out. For a detailed interpretation of the test results FEM simulations with $ANSYS^{®}$ were performed. Finally, the results were used to predict the lifetime of the daisy chains and to calculate the activation energy for the IMC formation.
Starting Page	1
Ending Page	4
File Size	285282
Page Count	4
File Format	PDF
ISBN	9781424475933
e-ISBN	9781424475940
DOI	10.1109/CPMTSYMPJ.2010.5679664
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-08-24
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromigration Materials Reliability Compounds Finite element methods Acceleration Stress
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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