NDLI: Air-cooling optimization at system level

Content Provider	IEEE Xplore Digital Library
Author	Gradinger, T.B.
Copyright Year	2011
Description	Author affiliation: ABB Switzerland Ltd., Segelhofstrasse 1 K, 5405 Baden 5 Dättwil, Switzerland (Gradinger, T.B.)
Abstract	A computational model and a method is presented for the optimization of air cooling for power electronics in terms of thermal performance, cooling-system size and acoustic noise, which are key parameters for power-electronic applications. A number of case studies is performed, showing the relationship and the trade-offs between these quantities. In general increasing thermal performance leads to bigger size and/or higher noise, while lowering noise for constant thermal performance increases size. Within the basic physical limits, optimization is possible, which must be carried out at system level, as the results cannot be found by separately optimizing individual cooling-system components. Examples are the enlargement of the heat sink or the addition of volume for porous duct lining, which both can lead to a smaller overall system for fixed thermal performance and noise. Furthermore it can be said that any measure to reduce pressure drop, such as the introduction of guiding vanes in a bend, reduces size and/or noise at fixed thermal performance. The results are shown to be in accordance with theoretical scaling laws, relating thermal resistance, size and sound pressure. The trade-off between thermal performance, size and noise worked out for air-cooling systems is expected to be of general nature, applying to any kind of cooling system. In future work, the present method could be used to compare air cooling with other types of cooling systems, in particular water cooling and two-phase cooling.
Starting Page	1
Ending Page	10
File Size	606977
Page Count	10
File Format	PDF
ISBN	9781612841670
e-ISBN	9789075815146
e-ISBN	9789075815153
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-08-30
Publisher Place	United Kingdom
Access Restriction	Subscribed
Rights Holder	EPE ASSOCIATION
Subject Keyword	Insulated gate bipolar transistors modeling Atmospheric modeling Computational modeling Noise simulation cooling Mathematical model thermal design Heat sinks acoustic noise
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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