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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Nguyen, Vh. Castelan, P. Khatir, Z. Lebey, T. Bley, V. Sewraj, N. Luan, Qh. Schlegel, B. |
| Copyright Year | 2009 |
| Description | Author affiliation: Institut National de REcherche sur les Transports et leur Sécurité, 2. Av. Malleret-Joinville, 94114 Arcueil Cedex (Khatir, Z.) || Université de Toulouse, LAPLACE_Laboratoire Plasma et Conversion d'Energie, 118 route de Narbonne, F-31062 Toulouse cedex 9, France (Nguyen, Vh.; Castelan, P.; Lebey, T.; Bley, V.; Sewraj, N.; Luan, Qh.; Schlegel, B.) |
| Abstract | Direct Copper Bonded (DBC) bottom die substrate attachment is usually ensured by solder joints but with regard to reliability it remains the weakest component of the package. The sustained trend for high power density requires new interconnection technologies. Nano-wires seem to be a promising candidate for interconnection applications in power electronics and microelectronics [1–5]. This paper presents the fabrication process of an innovative solderless interconnection based on copper nano-wires by electroplating process, itself using the Anodic Aluminum Oxide (AAO) template. Some mechanical and electrical characterizations are investigated in order to evaluate this interconnection technology. |
| Starting Page | 1 |
| Ending Page | 9 |
| File Size | 2672781 |
| Page Count | 9 |
| File Format | |
| ISBN | 9781424444328 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-09-08 |
| Publisher Place | Spain |
| Access Restriction | Subscribed |
| Subject Keyword | Power semiconductor device Solder-less interconnections Power electronics Microelectronics Electroplating Power Integration Pressure contact Aluminum oxide Fabrication Wires AAO template Packaging Nanowires Copper Bonding Soldering Nano wires Electronics packaging |
| Content Type | Text |
| Resource Type | Article |
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