NDLI: Total productive maintenance in a semiconductor manufacturing firm: an empirical analysis

Content Provider	IEEE Xplore Digital Library
Author	Ng, K.C. Goh, G.G.G. Eze, U.C.
Copyright Year	2011
Description	Author affiliation: Infineon Technologies, Melaka, Malaysia (Ng, K.C.) \|\| Faculty of Business & Law, Multimedia University, Melaka, Malaysia (Goh, G.G.G.) \|\| School of Business, Monash University Sunway, Malaysia (Eze, U.C.)
Abstract	Total productive maintenance is claimed to play a key role in improving maintenance and engineering performance in firms. With the use of TPM, manufacturing organizations would be able to reduce wastage and enhance productivity. This study is conducted in a large semiconductor manufacturing firm in Malaysia and analyses the secondary data obtained from the total fabrication monitoring system using paired samples t-test. The results indicate that all the performance measures indicate significant improvements after TPM implementation which lends support to the claim of the effectiveness of TPM. Hence, manufacturing firms need to seriously weigh the pros and cons of TPM implementation and take the necessary steps needed to effectively deploy TPM to enjoy better machine performance rates for increased productivity levels.
Starting Page	829
Ending Page	833
File Size	597851
Page Count	5
File Format	PDF
ISBN	9781457707407
ISSN	2157362X
e-ISBN	9781457707391
e-ISBN	9781457707384
DOI	10.1109/IEEM.2011.6118032
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Availability Productivity Semiconductor device measurement comparison analysis Total productive maintenance secondary data analysis Maintenance engineering Throughput Manufacturing
Content Type	Text
Resource Type	Article

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