NDLI: Thermomechanical behavior of BGA solder joints under vibrations: an experimental observation

Content Provider	IEEE Xplore Digital Library
Author	Zhao, Y. Basaran, C. Cartwright, A. Dishongh, T.
Copyright Year	2000
Description	Author affiliation: Electron. Packaging Lab., State Univ. of New York, Buffalo, NY, USA (Zhao, Y.)
Abstract	Recent trends in reliability and fatigue life analysis of electronic devices have involved developing structural integrity models for predicting the operating lifetime under vibratory and thermal environmental exposure. Solder joint reliability is the most critical issue for the structural integrity of surface mounted electronics. Extensive research has been done on thermal behavior of solder joints, however, dynamic loading effects on solder joint fatigue life have not been thoroughly investigated. The physics of solder joint failure under vibration is still not very clear. This paper presents a test program which was performed to study inelastic behavior of solder joints of BGA packages. A concurrent loading unit is used which consists of a thermal environmental chamber and an electrodynamic shaker. Laser Moire Interferometry was used to measure the whole deformation field of the prepared specimen surface. The corresponding inelastic strain field is then calculated. It is found that at elevated temperature, vibration and shock can cause the accumulation of inelastic strains and damage in solder joints. In this paper, contrary to the popular belief that all vibration-induced strains are elastic, it is shown that vibration can cause significant inelastic strains.
Starting Page	349
Ending Page	355
File Size	680763
Page Count	7
File Format	PDF
ISBN	0780359127
ISSN	10899870
DOI	10.1109/ITHERM.2000.866213
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Soldering Capacitive sensors Fatigue Electronic packaging thermal management Thermal loading Predictive models Physics Testing Performance evaluation
Content Type	Text
Resource Type	Article

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