NDLI: Effects of plasticity on reliability in multilayered electronic packages

Content Provider	IEEE Xplore Digital Library
Author	Shaw, M.C. He, J. Mather, J.C. Addison Jr., R.C.
Copyright Year	2000
Description	Author affiliation: Rockwell Sci. Center, Thousand Oaks, CA, USA (Shaw, M.C.)
Abstract	The effect of the constitutive response of the solder material on the reliability of large area solder joints within multilayered electronic packages is investigated subject to repeated thermal cycling. Solders that exhibit elastic and time-dependent plastic flow (viscoplasticity) were investigated. In accordance with traditional low-cycle fatigue models, the solder that exhibited extensive viscoplasticity exhibited fatigue cracking that can be modelled following a Coffin-Manson approach for crack initiation. Subsequent crack growth was pronounced. In contrast, the solder that exhibited an elastic response exhibited a substantially lower fatigue crack nucleation and growth rate. These results are then related to the overall design philosophy of the package.
Starting Page	279
Ending Page	286
File Size	594165
Page Count	8
File Format	PDF
ISBN	0780359127
ISSN	10899870
DOI	10.1109/ITHERM.2000.866203
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Plastic packaging Soldering Fatigue Insulated gate bipolar transistors Joining materials Electronic packaging thermal management Materials reliability Stress Multichip modules
Content Type	Text
Resource Type	Article

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