NDLI: Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection

Content Provider	IEEE Xplore Digital Library
Author	Lohan, J. Tiilikka, P. Rodgers, P. Fager, C.-M. Rantala, J.
Copyright Year	2000
Description	Author affiliation: Mech. & Ind. Eng. Dept., Galway-Mayo Inst. of Technol., Ireland (Lohan, J.)
Abstract	As the functionality of electronic systems increase, so does the complexity of printed circuit board (PCB) design, with greater component packing densities requiring additional internal signal, power and ground layers to facilitate interconnection. The extra copper content introduced increases PCB thermal conductivity and heat spreading capability, which can strongly influence component operating temperature. Therefore, this experimental study sought to quantify the impact of PCB construction on component operating temperature and relate this sensitivity to the package design, PCB effective conductivity and convective environment. This was achieved by measuring the steady state thermal performance of four package types (PSO20: heat slug up, PSO20: heat slug down, LFBGA80 and SBGA352) on up to six different, single-component thermal test PCBs in the standard natural and forced convection environments. Test velocities ranged from 0.5 m/s to 5.0 m/s and all test components contained a thermal test die. Measurements of junction temperature and component-PCB surface temperature distributions are both presented for power dissipation levels within the range 0.5 to 6.0 Watts. The study includes the low and high conductivity JEDEC standard, FR4-based test PCBs and typical application boards. As each PCB had a different internal structure and effective thermal conductivity, this study highlights the sensitivity of component operating temperature to the PCB, provides benchmark data for validating numerical models, and helps one assess the applicability of standard junction-to-air thermal resistance (/spl theta//sub JA/ and /spl theta//sub JMA/), as well as both junction-to-board (/spl Psi//sub JB/) and junction-to-top (/spl Psi//sub JT/) thermal characterisation parameters for design purposes on nonstandard PCBs.
Starting Page	213
Ending Page	225
File Size	1295894
Page Count	13
File Format	PDF
ISBN	0780359127
ISSN	10899870
DOI	10.1109/ITHERM.2000.866194
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal conductivity Testing Electronic packaging thermal management Thermal resistance Temperature sensors Land surface temperature Thermal force Temperature measurement Temperature distribution Printed circuits
Content Type	Text
Resource Type	Article

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