NDLI: Stress/strength and reliability evaluations on UBM in different solder systems

Content Provider	IEEE Xplore Digital Library
Author	Guo, Y. Shun-Meen Kuo Mercado, L.
Copyright Year	2000
Description	Author affiliation: Semicond. Products Sect., Motorola Inc., Tempe, AZ, USA (Guo, Y.)
Abstract	UBM (Under Bump Metallurgy) reliability is one of the critical issues in the total reliability of a flip-chip bumping technology. Since the UBM materials and structures vary for different bumping technologies, the UBM strength and reliability need to be determined for each design and process. In addition, the stress that a UBM experiences during thermal cycles depends on the solder alloy used in the interconnect. Different solder alloys require different UBM structures and strengths to achieve good reliability thermal cycling. In this study, a simplified stress model is developed to determine the UBM stress during thermal cycling. A simplified stress model for the UBM strength is also developed. These models are used to predict the stress and strength of the UBM under the die pull test and the thermal cycle conditions for both eutectic and high lead solder systems. A methodology for using the pull test results to evaluate UBM reliability is also discussed. This methodology can be extended to the studies of UBMs with other solder systems.
Starting Page	193
Ending Page	199
File Size	568595
Page Count	7
File Format	PDF
ISBN	0780359127
ISSN	10899870
DOI	10.1109/ITHERM.2000.866191
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal stresses Lead System testing Tensile stress Semiconductor device reliability Strain measurement Semiconductor materials Materials reliability Process design Predictive models
Content Type	Text
Resource Type	Article

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