NDLI: The precision-engineered heat pipe for cooling Pentium II in CompactPCI design

Content Provider	IEEE Xplore Digital Library
Author	Yu, Z.Z. Harvey, T.
Copyright Year	2000
Description	Author affiliation: Thermacore Inc., Lancaster, PA, USA (Yu, Z.Z.)
Abstract	The CompactPCI standard was developed originally by Ziatech. It provides a way to combine the performance and the low cost of the PCI (Peripheral Component Interconnection) standard with a small, rugged computer form factor ideal for embedded applications. It functions as a 6U CompactPCI peripheral processor in a CompactPCI multiprocessing system (CompactPCI/MP), and operates in a peripheral slot, while the system CPU master operates in the system slot. The ZT 5540 is an ideal solution for telecommunication applications, such as pre-processor or protocol converter functions. The board occupies one or two CompactPCI slots depending on the configuration. A 14-watt processor module for the CompactPCI needs a proper thermal management solution under its thermal specifications. The challenge of the thermal management solution includes both thermal and mechanical design. Heat pipes are passive devices with high reliability and low cost. They have been widely used in electronic cooling. Transferring the heat load from the heat source to another location where the space is available for the heat sink is one of the major advantages of the heat pipe. With the special features of the heat pipe, both thermal and mechanical challenges of the thermal management solution can be achieved. The thermal analysis on the design is presented and subsequently verified by the test data.
Starting Page	102
Ending Page	105
File Size	336453
Page Count	4
File Format	PDF
ISBN	0780359127
ISSN	10899870
DOI	10.1109/ITHERM.2000.866177
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cooling Thermal management of electronics Space heating Heat sinks Heat transfer Thermal management Costs Application software Standards development Computer peripherals
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in