NDLI: A comparison between moire interferometry and strain gages for effective CTE measurement in electronic packages

Content Provider	IEEE Xplore Digital Library
Author	Ratanawilai, T. Hunter, B. Subbarayan, G. Rose, D.
Copyright Year	2000
Description	Author affiliation: Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA (Ratanawilai, T.)
Abstract	High-sensitivity laser moire interferometry technique has proven to be invaluable in characterizing electronic packages. It is often contrasted to the classical strain gage technique as a more powerful, whole-field alternative for the characterization of electronic packages. In this paper, we present a systematic comparison of the accuracy of thermal strains measured using the moire technique to that obtained using strain gages. The effective thermal strains in approximately twenty printed circuit board specimens were measured using the two techniques. The results of the two techniques showed good overall correlation, but differed from each other by as much as 2.73 PPM. The possible sources of error in each technique are identified and discussed. Of practical significance, the measured effective coefficient of thermal expansion varied in wide range by as much as 5 PPM about the commonly used value of 17 PPM. This has been shown in a related study as causing a significant reliability impact for a plastic ball grid array package assembly.
Starting Page	246
Ending Page	252
File Size	554398
Page Count	7
File Format	PDF
ISBN	0780359127
ISSN	10899870
DOI	10.1109/ITHERM.2000.866198
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Strain measurement Interferometry Electrons Electronic packaging thermal management Capacitive sensors Electronics packaging Plastic packaging Assembly Soldering Printed circuits
Content Type	Text
Resource Type	Article

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