NDLI: Studies of Solder Joint Reliability under Mechanical Bending Test on FR-4 PCBs with Sn-4.0Ag-0.5Cu Solder Paste

Content Provider	IEEE Xplore Digital Library
Author	Si Chen Peng Sun Xicheng Wei Zhaonian Cheng Liu, J.
Copyright Year	2007
Description	Author affiliation: Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai (Si Chen; Peng Sun; Xicheng Wei)
Abstract	The mechanical bending test results, as well as the modeling and calculation data were presented in this study to characterize the solder joint reliability. Bending test was completed simply by loading a series of displacements on the FR-4 printed circuit board (PCB) with devices and solder joints in single direction. A special bending tester that can control displacement exactly by a cam system was designed and used for reliability study. The three group samples need to endure bend distortion with different deflections respectively, namely 3 mm, 4 mm, and 5 mm. The electrical resistance was probed every 3600 cycles by multimeter. When the resistance of solder joint got 10% increase, the failure can be defined. The experimental results indicate that the fatigue life decreased obviously with the displacement increased. By using optical microscope and SEM photographs, two kinds of failure model were found in solder joints. The majority failure model, which took place at the bottom corner of solder joint under the termination of resistor initially, and propagated into the solder matrix. The delamination appeared at the interface between the termination of resistor and its ceramic body. The finite element analysis was presented to support this experiment. The shear strain ranges under the different deflections were obtained from simulation. A Coffin-Mason equation of Sn-4.0Ag-0.5Cu from literature was used to compare with this experimental result and prove the feasibility of two points bending test in fatigue life prediction.
Starting Page	1
Ending Page	6
File Size	1188472
Page Count	6
File Format	PDF
ISBN	1424412528
DOI	10.1109/HDP.2007.4283622
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-06-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Circuit testing Electric resistance Fatigue Optical microscopy Scanning electron microscopy Resistors Printed circuits System testing Displacement control
Content Type	Text
Resource Type	Article

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