NDLI: A Comparative Study of Failure Mechanisms of Sn-Ag-Cu Assemblies under Temperature Cycling and Board Level Drop Test

Content Provider	IEEE Xplore Digital Library
Author	Yanghua Xia Xiaoming Xie
Copyright Year	2007
Abstract	The reliability performance and failure mechanisms of lead-free electronic assemblies under temperature cycling and board level drop test was investigated. TSOP (thin small outline package) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder paste. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) on the reliability performance were studied. The results show that the assemblies with OSP finishes outperform its ENIG counterparts under temperature cycling, however, the ENIG assemblies reveal better reliability performance than those with OSP finishes under drop test. The failure mechanism is different under these two test conditions: the solder joints fracture into the intermetallic compounds (IMCs) layer under drop test, and cracks initiate in the bulk solder near to the interface under temperature cycling. The surface finishes also have an effect on the failure mode under temperature cycling. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface.
Starting Page	1
Ending Page	5
File Size	1133093
Page Count	5
File Format	PDF
ISBN	1424412528
DOI	10.1109/HDP.2007.4283561
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-06-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Failure analysis Assembly Temperature Circuit testing Environmentally friendly manufacturing techniques Lead Electronic equipment testing Electronics packaging Printed circuits Nickel Drop test Lead-free Intermetallic compounds Reliability Temperature cycling
Content Type	Text
Resource Type	Article

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