NDLI: Modeling of mixed-mode delamination by cohesive zone method

Content Provider	IEEE Xplore Digital Library
Author	Bingbing Zhang Daoguo Yang Ernst, L. Pape, H.
Copyright Year	2013
Description	Author affiliation: Guilin Univ. of Electron. Technol., Guilin, China (Bingbing Zhang; Daoguo Yang) \|\| Infineon Technol. AG, Munich, Germany (Pape, H.) \|\| Ernst Consultant, Schoonhoven, Netherlands (Ernst, L.)
Abstract	Cohesive zone modeling of interface delamination requires proper values of the critical energy release rate of the interfaces being under investigation. In general, these values have been obtained thru dedicated delamination experiments. In cohesive zone modeling a complication to deal with is the fact that the critical energy release rate is not just a single value. Instead, it is a function of the socalled mode-mixity, a parameter depending from the ration between shear stress and tensile stress near the crack front. Most of the standard FEM packages include one or more types of cohesive zone elements, but generally, a mode-mix dependency cannot be specified. This might hinder a proper usage of cohesive zones in FEM modeling of microelectronic components. Therefore, the suitability of various FEM packages to deal with mixed mode delamination through cohesive zone modeling should be explored. The present paper describes such an exploration using the ANSYS package. Various mixed mode delamination experiments have been modeled using an available mixed mode cohesive zone model. The results are compared to the experimental results.
Sponsorship	IEEE Components, Packaging Manuf. Technol. Soc.
Starting Page	1
Ending Page	7
File Size	1621984
Page Count	7
File Format	PDF
ISBN	9781467361385
e-ISBN	9781467361392
DOI	10.1109/EuroSimE.2013.6529986
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-04-14
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Load modeling Abstracts Clamps Materials Electromagnetic compatibility Thermal conductivity Thermal loading
Content Type	Text
Resource Type	Article

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