NDLI: “Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys”

Content Provider	IEEE Xplore Digital Library
Author	Eckermann, J. Mehmood, S. Davies, H.M. Lavery, N.P. Brown, S.G.R. Sienz, J. Jones, A. Sommerfeld, P.
Copyright Year	2013
Description	Author affiliation: Coll. of Eng., Swansea Univ., Swansea, UK (Sienz, J.) \|\| Electron. Motion Syst. UK Ltd., Swansea, UK (Sommerfeld, P.)
Abstract	The aim of this investigation was to understand the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder alloys including SAC105, SAC305, SAC405 and Sn-36Pb-2Ag. Both the impacts of thermal power cycles (80 to 150 °C) and thermal sh°Ck cycles (-40 to 125 °C) on solders were simulated by using the constitutive equation based on Anand's viscoplasticity model. From these results, lifetime-predictions of solder joints were derived using Coffin Manson pr°Cedures.
Sponsorship	IEEE Components, Packaging Manuf. Technol. Soc.
Starting Page	1
Ending Page	8
File Size	1484037
Page Count	8
File Format	PDF
ISBN	9781467361385
e-ISBN	9781467361392
DOI	10.1109/EuroSimE.2013.6529901
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-04-14
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Computational modeling Lead Abstracts Copper Stress Finite element analysis
Content Type	Text
Resource Type	Article

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Thermo-mechanical behaviour analysis of micro-solder joints by finite element modelling

Combined creep and fatigue measurement method for lead-free solder alloys

Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder

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FEA based reliability prediction for different Sn-based solders subjected to fast shear and fatigue loadings

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Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue

“Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys”

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