NDLI: Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique

Content Provider	IEEE Xplore Digital Library
Author	Jankowski, K. Swierczynski, R. Urbanski, K. Wymyslowski, A. Chicot, D. Dudek, R.
Copyright Year	2013
Description	Author affiliation: LML, Univ. Lille Nord of France, Villeneuve-d'Ascq, France (Chicot, D.) \|\| Fraunhofer-Inst. fur Elektron. Nanosyst., Chemnitz, Germany (Dudek, R.) \|\| Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland (Jankowski, K.; Swierczynski, R.; Urbanski, K.; Wymyslowski, A.)
Abstract	Last decades in reliability prototyping of microelectronic devices show that from a long time there is no good solution to examine it in relatively short time and small expenditure of costs. Currently all thermo-mechanical reliability processes are long-lasting and costly. With using only the most dominating failure mode and cyclic loadings tests can last for a number of months. Companies, which produce their products very fast can't allow on such inconvenience, because this would lead to bankruptcy. To solve that kind of problem in this paper will be proposed new method of reliability investigating. Most of existing methods are concerned on only one failure mode which is dominating under selected loading conditions. Moreover all failure analysis are done under the simplified conditions what means that obtained results are not properly reliable. New presented method aim at using typical failure modes creep and fatigue at the same time while testing. That solution can have an important meaning in the standard Accelerated Thermal Cyclic test, which are based partly on experiment measurements and numerical analysis. Therefore appropriate understanding and development of analytical methods and experimental tools for multifailure criteria analysis could be very helpful. This work presents a methodology based on the use of well known indentation technique and second, innovative method with using new instrument called Failure And Reliability Investigation System created to study creep and fatigue phenomenon carried out on two lead-free alloys: SAC 405(S-SnAg4Cu0.5) and SAC 307(S-SnAg3Cu0.7).
Sponsorship	IEEE Components, Packaging Manuf. Technol. Soc.
Starting Page	1
Ending Page	4
File Size	996389
Page Count	4
File Format	PDF
ISBN	9781467361385
e-ISBN	9781467361392
DOI	10.1109/EuroSimE.2013.6529921
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-04-14
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Reliability Force Temperature measurement Abstracts Load modeling Analytical models Numerical models
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Creep and fatigue as main degradation phenomena in reliability of solder joints

Reliability Evaluation of BGA Solder Joints by Using Thermal Fatigue Models

The Reliability of SAC305 Individual Solder Joints during Creep–Fatigue Conditions at Room Temperature

Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modeling and Experimental Results

Solder constitutive models and failure criteria selection in board level cyclic bending simulation

Acceleration of life prediction of solder joints using multi-failure criteria

Package fatigue reliability of the stacked chip BGA evaluated by optimal equivalent solder

Modeling of LED solder joint cracking during temperature cycling with Finite Element

Reliability of Wind Turbine components — Solder elements fatigue failure

Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique

Similar Documents

Creep and fatigue as main degradation phenomena in reliability of solder joints

Reliability Evaluation of BGA Solder Joints by Using Thermal Fatigue Models

The Reliability of SAC305 Individual Solder Joints during Creep–Fatigue Conditions at Room Temperature

Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modeling and Experimental Results

Solder constitutive models and failure criteria selection in board level cyclic bending simulation

Acceleration of life prediction of solder joints using multi-failure criteria

Package fatigue reliability of the stacked chip BGA evaluated by optimal equivalent solder

Modeling of LED solder joint cracking during temperature cycling with Finite Element

Reliability of Wind Turbine components — Solder elements fatigue failure

Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique