NDLI: Quantifying moisture diffusion into three-dimensional axisymmetric sealants

Content Provider	IEEE Xplore Digital Library
Author	Leslie, D. Dasgupta, A. de Vries, J.W.C.
Copyright Year	2013
Description	Author affiliation: Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD, USA (Leslie, D.; Dasgupta, A.) \|\| Philips Res., Netherlands (de Vries, J.W.C.)
Abstract	Moisture can be devastating for electronic components, causing corrosion and electrochemical metal migration, which leads to changes in resistance and short circuits. Although most products (the focus in this study is on solid state lighting products) have a sealed enclosure, the driver electronics are often not as well sealed against the environment. Moisture diffusion through surrounding sealants is a primary pathway of moisture ingress into the electronics enclosures. This study's focus is on quantifying the moisture diffusion rates for various sealant materials and on modeling the moisture ingress rates into sealed containers, using commercial FEA software. This paper also presents a simulation-assisted procedure to extract the moisture diffusion properties for the seal material because most seal structures (gaskets, O-rings, etc.) are not simple one-dimensional structures. The resulting geometric correction factor is obtained for toroidal O-rings of circular cross-section and also for elliptic cross-sections caused by compression forces.
Sponsorship	IEEE Components, Packaging Manuf. Technol. Soc.
Starting Page	1
Ending Page	4
File Size	1141636
Page Count	4
File Format	PDF
ISBN	9781467361385
e-ISBN	9781467361392
DOI	10.1109/EuroSimE.2013.6529902
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-04-14
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Moisture Moisture measurement Analytical models Permeability Abstracts Standards Isothermal processes
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Determination of moisture ingress rate through photovoltaic encapsulants

Measurement of moisture diffusion as a function of temperature and moisture concentration in transformer pressboard

Isothermal and non-isothermal transport of charge carriers in one-dimensional insulators

IMC's growth behavior and the characterization of its size during isothermal aging

Investigation of relaxation processes in thermally-aged XLPE cable models

Stress impact of moisture diffusion measured with the stress chip

Analytical Solutions Formulated in the Time Domain for Three-Dimensional Heat Diffusion Equation

Fast and accurate electro-thermal analysis of three-dimensional power delivery networks

Calculating leakage inductances of pancake windings in dry-type Traction transformers

Quantifying moisture diffusion into three-dimensional axisymmetric sealants

Similar Documents

Determination of moisture ingress rate through photovoltaic encapsulants

Measurement of moisture diffusion as a function of temperature and moisture concentration in transformer pressboard

Isothermal and non-isothermal transport of charge carriers in one-dimensional insulators

IMC's growth behavior and the characterization of its size during isothermal aging

Investigation of relaxation processes in thermally-aged XLPE cable models

Stress impact of moisture diffusion measured with the stress chip

Analytical Solutions Formulated in the Time Domain for Three-Dimensional Heat Diffusion Equation

Fast and accurate electro-thermal analysis of three-dimensional power delivery networks

Calculating leakage inductances of pancake windings in dry-type Traction transformers

Quantifying moisture diffusion into three-dimensional axisymmetric sealants