NDLI: Novel reliability assessment concept based on an accelerated de-rated strength approach

Content Provider	IEEE Xplore Digital Library
Author	Veninga, E.P. Kregting, R. van der Waal, A. Gielen, A.W.J.
Copyright Year	2013
Description	Author affiliation: TNO Tech. Sci. - Mater. for Integrated Products, Eindhoven, Netherlands (Veninga, E.P.; Kregting, R.; van der Waal, A.; Gielen, A.W.J.)
Abstract	The introduction of new materials or technologies can have an enormous impact on the Time to Market (TTM) of new products. Preferably, the performance of new materials or technologies is known before these are designed into a product. This paper presents a reliability assessment approach which has been developed with the aim to reduce the so called Time to Technology (TTT). The method which is based on an accelerated de-rated strength approach has been expanded to a concept which could also include health monitoring and prognostics during lifetime. In this part of the work a combination of modelling and statistical techniques was used to explore the feasibility and potential of the concept. Ball Grid Array (BGA) designs were used as a vehicle with solder fatigue as the selected failure mechanism. Finite Element Modelling (FEM) together with Design of Experiments (DoE) revealed that the (package) substrate thickness, stand-off, (package) substrate size and the final solder ball diameter are the statistical significant factors with respect to fatigue life of SnAgCu BGA balls. Simplified linear models obtained from regression analyses were used to design de-rated strength variants and estimate test times. Simulations using a strain based lifetime model of Engelmaier together with a Monte Carlo method were used to generate lifetime distributions based on induced variations. A statistical analysis showed a significant difference in lifetime performance between the simulated de-rated strength designs.
Sponsorship	IEEE Components, Packaging Manuf. Technol. Soc.
Starting Page	1
Ending Page	5
File Size	967851
Page Count	5
File Format	PDF
ISBN	9781467361385
e-ISBN	9781467361392
DOI	10.1109/EuroSimE.2013.6529983
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-04-14
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Reliability Load modeling Abstracts Monitoring
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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