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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hua Gan Yufeng Jin Min Miao Xin Sun |
| Copyright Year | 2011 |
| Description | Author affiliation: National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing 100871, China (Hua Gan; Yufeng Jin; Min Miao; Xin Sun) |
| Abstract | This paper reports a novel accelerometer which is fabricated in LTCC thick-film process technology. The authors have introduced a LTCC compatible design and developed a fabrication process flow of this new kind of accelerometer. It is designed as a capacitive accelerometer, which consists of a seismic mass, four folded tie-beams, a fixed frame and two packaging plates. The sensing device is embedded in the LTCC substrate. The capacitive signals are conducted by LTCC multilayer interconnection and input to the signal detecting ASIC chip which is mounted on the substrate. The whole module functions as a system-in-package (SiP). The mechanical and electrical characterizations have been investigated by simulation. |
| Starting Page | 796 |
| Ending Page | 799 |
| File Size | 376693 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781612847757 |
| e-ISBN | 9781612847771 |
| DOI | 10.1109/NEMS.2011.6017474 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-02-20 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Accelerometers Capacitors Substrates Fabrication Capacitance Sensitivity Packaging System in Package (SiP) Low Temperature Co-fired Ceramic (LTCC) Accelerometer Capacitive Thick-film Process Packaging Substrate |
| Content Type | Text |
| Resource Type | Article |
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