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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Eneman, G. Brunco, D.P. Roussel, P.J. Hellings, G. Kubicek, S. Horiguchi, N. Collaert, N. Thean, A. |
| Copyright Year | 2013 |
| Description | Author affiliation: GLOBALFOUNDRIES, Ghent, Belgium (Brunco, D.P.) || Imec, Leuven, Belgium (Eneman, G.; Roussel, P.J.; Hellings, G.; Kubicek, S.; Horiguchi, N.; Collaert, N.; Thean, A.) |
| Abstract | We calculate band offsets for FinFETs with strained SiGeand strained InGaAs-channels on strain relaxed buffers (SRB) and provide specific guidelines to optimize quantum wells, metal gate work functions, and mobilities for group-IV and group-III/V devices. Quantum well carrier confinement of 200 meV (or greater) for the channel strongly improves DIBL and SS for 10 nm-node FinFETs. Such quantum wells can be achieved for the following combinations: a strained-Si channel nFinFET on a $Si_{0.6}Ge_{0.4}$ SRB; a strained $Si_{0.4}Ge_{0.6}$ channel pFinFET on a Si substrate; or an $In_{0.53}Ga_{0.47}As$ channel nFinFET on $In_{0.52}Al_{0.48}As/InP.$ When increasing the In% above 70% for InGaAs channel nFETs, sufficient band offset is also achieved when the channel is directly grown on an InP or an $In_{0.4}Ga_{0.6}As$ SRB. Both nand pFinFETs with SiGe-channels require n-type work function metals, while p-type work functions are needed for InGaAs-channel nFinFETs. Therefore a dual-work function gate scheme is required to co-integrate InGaAs nFETs and SiGe pFETs. |
| Sponsorship | IEEE Electron Devices Soc. |
| File Size | 804635 |
| File Format | |
| ISBN | 9781467352260 |
| ISSN | 21589682 |
| e-ISBN | 9784863483477 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-06-11 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | JSAP |
| Subject Keyword | FinFETs Silicon Silicon germanium Indium phosphide Photonic band gap Metals Indium gallium arsenide |
| Content Type | Text |
| Resource Type | Article |
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