NDLI: Structure of the breakdown spot during progressive breakdown of ultra-thin gate oxides

Content Provider	IEEE Xplore Digital Library
Author	Palumbo, F. Lombardo, S. Pey, K.L. Fang, L.J. Tung, C.H. Lin, W.H. Radhakrishnan, M.K. Falci, G.
Copyright Year	2004
Description	Author affiliation: Sezione di Catania, CNR, Catania, Italy (Palumbo, F.; Lombardo, S.)
Abstract	It has been recently shown that the progressive breakdown (BD) is the dominant BD mode under operating conditions in CMOS circuits. Progressive BD at operating voltages can be very slow,with respect to the conditions of standard accelerated tests. It may take many years to reach gate leak-age levels large enough to appreciably disturb the circuit operation. The disturb level depends on the post-BD gate oxide conductance. For example, in an SRAM cell, to lose the noise margin for correct operation, BD spot resistances below about 50 k/spl Omega/ have to be reached. To correctly predict the behavior of a circuit with one or more transistors in BD, it is important to have an accurate model of the conduction through the BD spot during progressive BD. For a correct modeling it is, in turn, necessary to determine the physical structure of the BD spot. We have focused our study on trying to determine this structure during progressive BD. Based on this analysis we propose a quantitative model of post-BD conductance. hi this paper we present the main results of this activity.
Starting Page	583
Ending Page	584
File Size	201250
Page Count	2
File Format	PDF
ISBN	078038315X
DOI	10.1109/RELPHY.2004.1315400
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-04-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electric breakdown MOSFETs Circuits Voltage Microelectronics Pulp manufacturing Semiconductor device manufacture Manufacturing industries Wood industry Life estimation
Content Type	Text
Resource Type	Article

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