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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Bhuyan, A. Choe, J.W. Byung Chul Lee Wygant, I. Nikoozadeh, A. Oralkan, O. Khuri-Yakub, B.T. |
| Copyright Year | 2013 |
| Description | Author affiliation: Stanford Univ., Stanford, CA, USA (Bhuyan, A.; Choe, J.W.; Byung Chul Lee; Nikoozadeh, A.; Khuri-Yakub, B.T.) || Texas Instrum., Santa Clara, CA, USA (Wygant, I.) || North Carolina State Univ., Raleigh, NC, USA (Oralkan, O.) |
| Abstract | 3D ultrasound imaging is becoming increasingly prevalent in the medical field. Compared to conventional 2D imaging systems, 3D imaging can provide a detailed view of tissue structures that makes diagnosis easier for the physicians. In addition, 2D image slices can be formed at various orientations to the transducer, making the examination less dependent on the skill of the sonographer. However, various challenges exist in developing a 3D imaging system, such as integration of a large number of elements, as well as post-processing of datasets received from a large number of channels. 2D transducer arrays are typically integrated with custom ICs in the probe handle to perform some intermediate beamforming and to reduce the number of cable connections to the imaging system. Capacitive micromachined ultrasonic transducers (CMUTs) have emerged as an alternative to piezoelectric transducers. Being a MEMS device, they greatly benefit from flexibility and ease of fabrication, and can be seamlessly integrated with electronics. Previous work demonstrates 3D stacking of CMUTs and dummy ICs with an intermediate interposer layer. However, that represents more of a mechanical demonstration of 3D integration. In this paper, we present a fully functional 3D ultrasound imaging system comprising a 32×32 2D CMUT array, 3D-stacked with front-end ICs using flip-chip bonding technology. The imaging system is capable of capturing real-time volumetric ultrasound data, and displaying 2D and 3D ultrasound images. |
| Sponsorship | IEEE Solid-State Circuits Soc. |
| Starting Page | 396 |
| Ending Page | 397 |
| File Size | 649878 |
| Page Count | 2 |
| File Format | |
| ISBN | 9781467345156 |
| ISSN | 01936530 |
| e-ISBN | 9781467345163 |
| DOI | 10.1109/ISSCC.2013.6487786 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-02-17 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Arrays Imaging Integrated circuits Three-dimensional displays Flip-chip devices Ultrasonic imaging Bonding |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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