NDLI: Fine-pitch high-density PGA package

Content Provider	IEEE Xplore Digital Library
Author	Harada, S. Sugimoto, M. Matsuki, H. Sumi, Y. Ueno, S. Murakami, S.
Copyright Year	1990
Description	Author affiliation: Fujitsu Ltd., Kawasaki, Japan (Harada, S.; Sugimoto, M.; Matsuki, H.; Sumi, Y.; Ueno, S.; Murakami, S.)
Abstract	A 462-pin PGA (pin-grid-array) package that has 636- mu m pin pitch is described. The package substrate and heat sink are made of AlN ceramic. An LSI chip is attached directly on the heat sink. The package has a thermal impedance of less than 0.1 degrees C/W because of the high thermal conductivity of AlN. Further, the thermal coefficients of expansion of AlN and Si are closely matched. The package is 17 mm/sup 2/ and 3.55 mm high. By using 100- mu m-pitch tape-automated-bonding (TAB) technology for both inner lead bonding (ILB) and outer lead bonding (OLB), the maximum size chip mountable on the package is 13.5 mm/sup 2/. The area ratio of package to chip is 1.6, a factor of 3 to 5 better than conventional packages.
Starting Page	154
Ending Page	155
File Size	452386
Page Count	2
File Format	PDF
DOI	10.1109/ISSCC.1990.110173
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-02-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Thermal conductivity Heat sinks Ceramics Thermal expansion Fabrication Lead Polyimides Wafer bonding Substrates
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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