NDLI: High performance heat sink for surface mount applications

Content Provider	IEEE Xplore Digital Library
Author	McKeown, S.A. LeVasseur, R.D.
Copyright Year	1991
Description	Author affiliation: General Electric Aerospace, Binghamton, NY, USA (McKeown, S.A.; LeVasseur, R.D.)
Abstract	Surface-mounted electronic module configurations are sensitive to thermal cycling because the reduced compliance between the component and module increases the thermally induced strain in the solder joint. Providing a thermal match between the component and the module reduces this strain, reduces low-cycle fatigue damage, and increases solder joint life. One way of achieving this thermal match is through the use of a thermally matched heat sink. In addition to having the required coefficient of thermal expansion (CTE), heat sinks for surface-mount avionic configurations require low weight and high thermal conductivity. A heat sink has been developed that has thermal conductivity close to aluminum, a CTE close to ceramic, and a weight density only 8% higher than aluminum. The flexural modulus of this heat sink is 40% higher than aluminum, which results in improved vibration performance. It is laminated, consisting of a thicker layer of graphite between thinner layers of copper-clad molybdenum,.<>
Starting Page	153
Ending Page	157
File Size	426315
Page Count	5
File Format	PDF
DOI	10.1109/DASC.1991.177158
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1991-10-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat sinks Surface-mount technology Aluminum Conducting materials Thermal expansion Thermal conductivity Electronics packaging Lead Ceramics Aerospace electronics
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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