NDLI: Polymer sensorised microgrippers using SMA actuation

Content Provider	IEEE Xplore Digital Library
Author	Houston, K. Eder, C. Sieber, A. Menciassi, A. Carrozza, M.C. Dario, P.
Copyright Year	2007
Description	Author affiliation: Scuola Superiore Sant'Anna, Pisa (Houston, K.; Eder, C.; Sieber, A.; Menciassi, A.; Carrozza, M.C.; Dario, P.)
Abstract	In this paper a polymer sensorised microgripping tool for micromanipulation is presented. The gripper structure is made by moulding of polyurethane in silicon moulds by the technique of shape deposition manufacturing (SDM), in which the force sensing elements and part of the actuator (in this case, microstrain gauges and SMA (shape memory alloy) wire, respectively) are embedded into the microgripper in one process step. The actuation principle for the microgripper is an SMA wire. The advantages of the fabrication process are low cost and manufacture cycle time. This paper details the technique for fabrication of the microgripper to produce prototypes. These prototypes were then tested and characterised in terms of force output, hysteresis and repeatability. A further miniaturised unsensorised microgripper based on the same actuation principle and fabrication process (but less than half the size) was fabricated to demonstrate the possibility of further downscaling.
Sponsorship	IEEE Robotics and Automation Soc
Starting Page	820
Ending Page	825
File Size	856122
Page Count	6
File Format	PDF
ISBN	1424406013
ISSN	10504729
DOI	10.1109/ROBOT.2007.363087
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-04-10
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polymers Grippers Fabrication Shape memory alloys Manufacturing processes Wire Prototypes Silicon Force sensors Actuators force sensor Micromanipulation Microgripper SMA
Content Type	Text
Resource Type	Article
Subject	Artificial Intelligence Control and Systems Engineering Electrical and Electronic Engineering Software

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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