NDLI: Impact of pre-existing voids on electromigration in copper interconnects

Content Provider	IEEE Xplore Digital Library
Author	Mario, H. Meng Keong Lim Gan, C.L.
Copyright Year	2012
Description	Author affiliation: School of Materials Science & Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798 (Mario, H.; Meng Keong Lim; Gan, C.L.)
Abstract	Previous in-situ electromigration experiments on copper interconnect have shown voids drifting towards the cathode, instead of nucleating at the cathode end. These voids could have pre-existed in the line before stressing and drifted towards the cathode. Furthermore, fatal voids observed from failure analysis that are located away from the cathode also strongly suggest, through modelling and simulation, that the voids grew from pre-existing ones. This failure mechanism is different under typical accelerated test conditions from what is expected at service conditions, and thus needs to be well understood. However, a design modification on the interconnect may help to reduce the impact of pre-existing voids on electromigration lifetime.
Starting Page	1
Ending Page	5
File Size	855700
Page Count	5
File Format	PDF
ISBN	9781467309806
ISSN	19461550
e-ISBN	9781467309837
DOI	10.1109/IPFA.2012.6306330
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-07-02
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cathodes Reservoirs Electromigration Stress Integrated circuit interconnections Failure analysis
Content Type	Text
Resource Type	Article

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