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Content Provider | IEEE Xplore Digital Library |
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Author | Issakov, V. Wojnowski, M. Thiede, A. Weigel, R. |
Copyright Year | 2009 |
Description | Author affiliation: Institute for Electronics Engineering, University of Erlangen-Nuremberg, Cauerstr. 9, D-91058 Erlangen, Germany (Weigel, R.) || Infineon Technologies AG, Am Campeon 1-12, D-85579 Neubiberg, Germany (Wojnowski, M.) || Dept. of High-Frequency Electronics, University of Paderborn, Warburgerstr. 100, D-33098 Paderborn, Germany (Issakov, V.; Thiede, A.) |
Abstract | Differential signaling is very common for high frequency integrated circuit design. Accurate multi-mode de-embedding at multigigahertz frequencies, however, is a major challenge. The differential and common-mode parameters can be obtained by converting the measured four-port nodal S-parameters into the mixed-mode form. Under certain conditions it is possible to separate the modes and consider only the entries corresponding to the differential S-parameters. This allows to reduce the measured 4×4 matrix to a 2×2 matrix and consider the differential device as a two-port network. Thus, the standard de-embedding techniques, derived for two-port networks, can be applied to differential S-parameters. The purpose of this paper is to investigate the applicability of this approach for on-wafer measurements. We describe analytically the conditions, under which this method is valid. As an example a 2:1 transformer, manufactured in Infineon's 0.13 µm CMOS process, has been characterized. On-chip de-embedding structures have been fabricated using the same process. The results obtained using Short-Open, Thru-Line and Thru-Line-Reflect de-embedding techniques are compared. |
Starting Page | 695 |
Ending Page | 698 |
File Size | 614144 |
Page Count | 4 |
File Format | |
ISBN | 9781424447480 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2009-09-29 |
Publisher Place | Italy |
Access Restriction | Subscribed |
Rights Holder | EUMA |
Subject Keyword | Frequency Scattering parameters Calibration Microwave devices Matrix converters CMOS process Millimeter wave measurements Microwave theory and techniques Integrated circuit technology Microwave technology |
Content Type | Text |
Resource Type | Article |
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