NDLI: Power-CAD: A novel methodology for design, analysis and optimization of Power Electronic Module layouts

Content Provider	IEEE Xplore Digital Library
Author	Hingora, N. Xiangyu Liu Yongfeng Feng McPherson, B. Mantooth, A.
Copyright Year	2010
Description	Author affiliation: National Center for Reliable Electric Power Transmission, University of Arkansas, Fayetteville, USA (Hingora, N.; Xiangyu Liu; Yongfeng Feng; Mantooth, A.) \|\| Arkansas Power Electronics International, Inc., Fayetteville, USA (McPherson, B.)
Abstract	Power Electronic Module (PEM) design requires simultaneous analysis of thermal, electrical, and mechanical parameters to design an optimal layout. The current design process being used by package designers involves a sequential procedure instead of a simultaneous process. Each design step involves the analysis of the thermal, electrical or mechanical aspects of the design. As a result, the designer has to iterate between the various design process steps in order to achieve an optimal design. This causes a substantial increase in the design cycle time. A new methodology has been developed and implemented in this work that helps to automate and optimize the PEM design process. Power-CAD uses an electrothermal simulation methodology, a parasitic extraction tool, and an optimization algorithm that helps to achieve an optimal layout for a discrete PEM. This approach promises to save time and money for the PEM design industry by significantly reducing the number of design cycles.
Starting Page	2692
Ending Page	2699
File Size	680139
Page Count	8
File Format	PDF
ISBN	9781424452866
DOI	10.1109/ECCE.2010.5618043
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-09-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Solid modeling Design automation Optimization methods Electronic packaging thermal management Power electronics Optimization Electrothermal analysis Electronic packaging Computer-aided design (CAD) Thermal analysis Mathematical model Power electronic modules (PEM) Integrated circuit modeling
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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