NDLI: An Electrothermally-Aware Full-Chip Substrate Temperature Gradient Evaluation Methodology for Leakage Dominant Technologies with Implications for Power Estimation and Hot-Spot Management

Content Provider	IEEE Xplore Digital Library
Author	Sheng-Chih Lin Banerjee, K.
Copyright Year	2006
Description	Author affiliation: Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA (Sheng-Chih Lin; Banerjee, K.)
Abstract	As CMOS technology scales into the nanometer regime, power dissipation and associated thermal concerns in high-performance ICs due to on-chip hot-spots and thermal gradients are beginning to impact VLSI design. Moreover, elevated substrate (junction or die) temperature strongly influences IC performance, reliability, and packaging/cooling cost. Hence, accurate estimation of substrate thermal profiles is critical. This paper presents an accurate chip-level electrothermally-aware methodology for spatial silicon substrate temperature estimation. The methodology self-consistently incorporates various electrothermal couplings arising mainly due to the strong dependence of subthreshold leakage on temperature and also employs an accurate package thermal model, to account for inhomogeneous layers and non-cubic structure, which are not considered in traditional methods. The proposed methodology becomes increasingly effective as technology scales due to increasing leakage. Furthermore, it is shown that considering realistic package thermal models not only improves the accuracy of estimating temperature distribution but also has significant implications for power estimation and hot-spot management
Starting Page	568
Ending Page	574
File Size	8940793
Page Count	7
File Format	PDF
ISBN	1595933891
ISSN	10923152
DOI	10.1109/ICCAD.2006.320176
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-11-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Association for Computing Machinery, Inc. (ACM)
Subject Keyword	Electrothermal effects Temperature Energy management Technology management CMOS technology Thermal management Power dissipation Very large scale integration Integrated circuit packaging Cooling
Content Type	Text
Resource Type	Article
Subject	Computer Graphics and Computer-Aided Design Computer Science Applications Software

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