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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Illes, B. Harsanyi, G. |
| Copyright Year | 2008 |
| Description | Author affiliation: Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary (Illes, B.; Harsanyi, G.) |
| Abstract | In this paper we present that how the graph theory can be used in the field of thermal study. We have developed a method which can describe the heat conduction ability of large size power components during the reflow soldering. Our method exploit that the heat conduction ability of the materials can be described with time coefficients which is determined by the thermal resistance and the heat capacity of the given material. We implemented this in a Matlab program which generates a directed and weighted graph from the discrete thermal model of the investigated component. The program uses the Dijsktra Algorithm to find the shortest "conduction ways" between the different parts of the component. With our method, the following effects can be studied during the soldering: the deviation between the generated conduction heat flows from the different faces of the component, from which direction and way get a chosen point the most heat, the effect of heat distraction, etc... |
| Starting Page | 420 |
| Ending Page | 425 |
| File Size | 341523 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424439720 |
| DOI | 10.1109/ISSE.2008.5276641 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-05-07 |
| Publisher Place | Hungary |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Conducting materials Assembly Reflow soldering Temperature distribution Manufacturing processes Ovens Semiconductor device modeling Resistance heating Thermal resistance Surface-mount technology |
| Content Type | Text |
| Resource Type | Article |
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