NDLI: Influence of mechanical stress and temperature aging on a change of electrical connection resistance

Content Provider	IEEE Xplore Digital Library
Author	Dusek, K. Tucan, M.
Copyright Year	2008
Description	Author affiliation: Dept. of Electrotechnol., Czech Tech. Univ. in Prague, Prague, Czech Republic (Dusek, K.; Tucan, M.)
Abstract	This article deals with the mechanical stress and the temperature aging of the lead and lead free soldered joints. Soldered joints have influence on a total quality of electronic assembly. Mechanical and temperature tests are mainly used for resistance evaluation of components, devices and whole products against stress. This stress takes effect during function, transport and storage of the devices. Mechanical stress and temperature aging can change electrical properties of the soldered joints, e.g. electrical resistance. Even a small change of the electrical resistance could cause the malfunction of the electrical equipment. This is especially in the case of electrical equipment with high current density. In this article, the changes of the electrical resistance of mechanically stressed and temperature aged soldered joints (lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5) are compared.
Starting Page	41
Ending Page	44
File Size	1251594
Page Count	4
File Format	PDF
ISBN	9781424439720
DOI	10.1109/ISSE.2008.5276475
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-05-07
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stress Temperature Aging Electric resistance Lead Environmentally friendly manufacturing techniques Assembly Testing Mechanical factors Current density
Content Type	Text
Resource Type	Article

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