NDLI: Investigation of die attach quality in power electronic devices

Content Provider	IEEE Xplore Digital Library
Author	Harkai, E. Balogh, B.
Copyright Year	2009
Description	Author affiliation: Department of Electronics Technology Budapest University of Technology and Economics, Hungary (Harkai, E.; Balogh, B.)
Abstract	The lifetime of electronic systems is highly influenced by the quality of the built-in electronic parts, so it is especially important that we could choose from a wide range of parts with the best fit to the conditions of usage. The aim of this paper is to describe what proportion of the die attach of a component will be delaminated beside different conditions. The following factors were taken into account: the physical parameters of the part, the conditions of the assembling and the conditions of the end usage. A test plan was set up with different types of components. Every group of components was separated into subgroups, these subgroups were exposed to different assembling and usage conditions. This test procedure provided information about whether the lead-free reflow process decreases the reliability of the die attach layer.
Starting Page	1
Ending Page	5
File Size	1880925
Page Count	5
File Format	PDF
ISBN	9781424442607
DOI	10.1109/ISSE.2009.5207048
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-05-13
Publisher Place	Czech Republic
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Power electronics Temperature Soldering Assembly Testing Environmentally friendly manufacturing techniques Lead Heat transfer Diodes
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Silver glues and lead-free alloys in die attach of power devices

Diffusion soldering for automotive power MOSFETs offers the first 100% lead free die attach

Alternative lead free die attach for power module packaging

Thermal performance and microstructure of lead versus lead-free solder die attach interface in power device packages

Increasing Value in Lead-Free Soldering with Nitrogen

Optimisation of Lead Free Solders Reflow Profile

Evaluation of Reflow Ovens for Lead-Free Soldering

Rework and reliability of QFP and BGA lead-free assemblies

Reliability and microstructure of lead-free solder die attach interface in silicon power devices

Investigation of die attach quality in power electronic devices

Similar Documents

Silver glues and lead-free alloys in die attach of power devices

Diffusion soldering for automotive power MOSFETs offers the first 100% lead free die attach

Alternative lead free die attach for power module packaging

Thermal performance and microstructure of lead versus lead-free solder die attach interface in power device packages

Increasing Value in Lead-Free Soldering with Nitrogen

Optimisation of Lead Free Solders Reflow Profile

Evaluation of Reflow Ovens for Lead-Free Soldering

Rework and reliability of QFP and BGA lead-free assemblies

Reliability and microstructure of lead-free solder die attach interface in silicon power devices

Investigation of die attach quality in power electronic devices