NDLI: Analyze of the environment temperature effect over hydro-energetic buildings resistive transducers

Content Provider	IEEE Xplore Digital Library
Author	Pop, S. Pitica, D. Ciascai, I. Bande, V.
Copyright Year	2009
Description	Author affiliation: Applied Electronics, Faculty of Electronics, Telecommunication and Information Technology, Technical University of Cluj-Napoca, 24-26, Baritiu, ROMANIA (Pop, S.; Pitica, D.; Ciascai, I.; Bande, V.)
Abstract	This paper makes a thermal study of a portable temperature measurement device under the influence of environment temperature. The portable device is used to measure sensors placed inside and outside of a hydro-energetic building (dams), where the ambient temperature range is between —20°C÷35°C. The self-heating phenomenon of electronics components cumulated with the ambient temperature increases the packaging temperature which affects the device measurement procedure. The usual electronic component that is affected by temperature variation is the resistor and the analog to digital convector, but the most significant error is caused by resistors. A through hole resistor used as a reference, with temperature coefficient of 10ppm/°C and tolerance of 1%, generates a measurement temperature error of 2.5 °C - with a 0.1% tolerance the error is reduced by 10 times. Modeling the temperature resistor behavior, the accuracy of measurement device can be less that 0.02°C. To establish the resistor temperature model a thermal imaging analyze is been made and using a microcontroller as a central unit, the temperature error can be eliminate by soft. The PCB components placement and positioning can be also optimized using the thermal image.
Starting Page	1
Ending Page	4
File Size	1303929
Page Count	4
File Format	PDF
ISBN	9781424442607
DOI	10.1109/ISSE.2009.5207035
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-05-13
Publisher Place	Czech Republic
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Transducers Temperature sensors Resistors Temperature measurement Electronic components Sensor phenomena and characterization Temperature distribution Electronics packaging Thermal resistance Image analysis
Content Type	Text
Resource Type	Article

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