NDLI: Polymer cure modeling for microelectronics applications

Content Provider	IEEE Xplore Digital Library
Author	Morris, J.E. Tilford, T. Bailey, C. Sinclair, K.I. Desmulliez, M.P.Y.
Copyright Year	2009
Description	Author affiliation: Department of Electrical & Computer Engineering, Portland State University, OR 97207-0751, USA (Morris, J.E.) \|\| MicroSystems Engineering Centre (MISEC), Heriot Watt University, Edinburgh EH14 4AS, UK (Sinclair, K.I.; Desmulliez, M.P.Y.) \|\| School of Computing & Mathematical Sciences, University of Greenwich, London SE10 9LS, UK (Tilford, T.; Bailey, C.)
Abstract	A review of polymer cure models used in microelectronics packaging applications reveals no clear consensus of the chemical rate constants for the cure reactions, or even of an effective model. The problem lies in the contrast between the actual cure process, which involves a sequence of distinct chemical reactions, and the models, which typically assume only one, (or two with some restrictions on the independence of their characteristic constants.) The standard techniques to determine the model parameters are based on differential scanning calorimetry (DSC), which cannot distinguish between the reactions, and hence yields results useful only under the same conditions, which completely misses the point of modeling. The obvious solution is for manufacturers to provide the modeling parameters, but failing that, an alternative experimental technique is required to determine individual reaction parameters, e.g. Fourier transform infra-red spectroscopy (FTIR).
Starting Page	1
Ending Page	6
File Size	1526614
Page Count	6
File Format	PDF
ISBN	9781424442607
DOI	10.1109/ISSE.2009.5206929
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-05-13
Publisher Place	Czech Republic
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polymers Microelectronics Mathematical model Application software Microwave ovens Isothermal processes Chemicals Electric resistance Temperature dependence Packaging
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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