NDLI: An analysis on oxidation, contamination, adhesion, mechanical stress and electro- etching effect toward DIP package delamination

Content Provider	IEEE Xplore Digital Library
Author	Wang Hui Teng Heng Chai Wei
Copyright Year	2010
Description	Author affiliation: Power Operations Development, Infineon Technologies Sdn Bhd, Batu Berendam, Melaka 73500, Malaysia (Wang Hui Teng; Heng Chai Wei)
Abstract	Package delamination forms a separation layer in between mold compound to chip, die paddle and leads, which subsequent affects ground bond quality and degrades package electrical performance. This paper focuses on the interaction relationship of each assembly process towards lead delamination in Dual in Line (DIP) package. No ground bond delamination is allowable to ensure the package robustness. An experiment was conducted to characterize and understand the effect of assembly-induced lead delamination. The identified critical processes include the staging time control from die placement to curing after die bond, contamination of volatile outgassing from epoxy A in poor air oven circulation during epoxy curing, thermal oxidation, mold compound wettability on leadframe during molding, electro-etching effect from deflashing as well as mechanical force from singulation were investigated. Electrolytic deflashing has identified as the primary root cuase of lead delamination due to electro etching effecct. Secondary factor to further increase the lead delamination is poor mold compound to leadframe adhesion due to imbalance mold flow, mechanical force from singulation and severe copper oxidation. Improved mold tooling concept will be beneficial to further minimize the imbalance mold flow between the top mold and bottom mold. Chemical dipping without electric current is recommended as promising lead delamination results and is reflected in C-SAM (Scanning Acoustic Miscoscope).
Starting Page	1
Ending Page	5
File Size	1327821
Page Count	5
File Format	PDF
ISBN	9781424488254
ISSN	10898190
e-ISBN	9781424488278
DOI	10.1109/IEMT.2010.5746700
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-11-30
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lead Delamination Robustness Chemicals Wire Assembly
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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