NDLI: Methods to Resolve Heel Stress for Ultra Thin QFN Small Package

Content Provider	IEEE Xplore Digital Library
Author	Siew Han Looe Soon Wei Wang Aripin, A.
Copyright Year	2007
Description	Author affiliation: ON Semicond., Seremban (Siew Han Looe; Soon Wei Wang; Aripin, A.)
Abstract	The current and future market demand for small, portable, compact and multi functional electronic products raises a great challenge to the semiconductor industries for small and thin package size, high quality, and high performance. The drive for package thickness thinning and package size reduction has created new challenges for current wire bonding technology which has led to small ball and low loop profile with largest possible wire size for the advantage of electrical performance. In the course of qualifying one of the ultra thin QFN (Quad Flat No-lead) small packages, gross heel stress was found at certain wire location in a high defect rate. First attempt in optimizing the wire bond power does not solve the heel stress problem. This indicates the complexity of the issue with existence of other significant influencing factors. DMAIC Methodology has been used to approach the problem in detail level. Several statistical analysis, design of experiment (DOE) and Finite Element Analysis (FEA) have been performed in order to narrow down to vital few. The FEA analysis in wire resonance has led the team to detail experiments in wire bonding sequence. Thorough analysis (through DOEs and statistical analysis) has been performed to identify the most optimized looping profile in distributing the ultrasonic power effectively. Package layout is fully explored as well to identify opportunities in improving the robustness of wire bonding. This paper explains in detail the hypothesis, statistical analysis, DOEs and FEA that have been performed to identify the root causes of this particular heel stress issue using DMAIC methodology. It is proven that the convergence of data driven and experience driven analysis through DMAIC methodology is the key to the success of this project. The convincing result shows that lead frame design, wire bonding direction, sequence, and loop profile are significant factors. This paper also illustrates all the solutions employed not only to eliminate the heel stress problem, but to enhance robustness in wire bonding as well.
Starting Page	28
Ending Page	33
File Size	4201625
Page Count	6
File Format	PDF
ISBN	9781424413355
ISSN	10898190
DOI	10.1109/IEMT.2007.4417051
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-10-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stress Wire Bonding Electronics packaging Semiconductor device packaging Statistical analysis Performance analysis Robustness Consumer electronics Industrial electronics
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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