NDLI: Integrated solution for high speed data filtering using package-in-package approach

Content Provider	IEEE Xplore Digital Library
Author	Bih Wen Fon Prajuckamol, A.
Copyright Year	2010
Description	Author affiliation: ON Semiconductor, SCG Industries Malaysia Sdn. Bhd., Lot 122, Senawang Industrial Estate, 70450 Seremban, N. Sembilan, Malaysia (Bih Wen Fon; Prajuckamol, A.)
Abstract	In addressing emerging high speed interface such as USB 2.0, IEEE1394, LVDS and DVI in electronic devices, discrete solution of using choke and ESD diodes is a common practice in the PCB assembly in eliminating the common mode noise and providing ESD protection to the electronice device [1]. However, this brings up the cost and cycle time as PCB manufacturers have to purchase several components and mount them separately on the PCB. Consequently, a larger PCB footprint is required. In this paper, we introduced the first-to-market integrated common mode filter with ESD protection using package-in-package technology in DFN platform. This is an integrated solution that offers cost savings and space reduction in responds to the needs of portable digital devices which are increasingly smaller and thinner. The attachment of passive component in a DFN package adds complexity to the existing assembly process. The use of lead free solder paste and its selection were discussed in this paper. Solder printing on lead frame was employed for the component placement due to its high process throughput compared to the conventional dispensing method. This paper also elaborated on the stencil design and solder printing characterization. It included the modification in lead frame design to enhance the product quality. The effect of solder reflow was also addressed in the paper. The final product was assembled with the newly established process flow and passed MSL 1 @ 260°C reliability test. The integrated package passed the reliablity stress tests and validated the concept of package-in-package in DFN platform.
Starting Page	1
Ending Page	5
File Size	609861
Page Count	5
File Format	PDF
ISBN	9781424488254
ISSN	10898190
e-ISBN	9781424488278
DOI	10.1109/IEMT.2010.5746697
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-11-30
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lead Printing Semiconductor diodes Reliability Electrostatic discharge Guidelines Inductors
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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