NDLI: The Solutions of Resistive Ball Bond Failure in Ultra Fine Pitch Wire Bonding

Content Provider	IEEE Xplore Digital Library
Author	Ibrahim, M.R. Siong Chin Teck Yong Cheng Choi
Copyright Year	2007
Description	Author affiliation: Freescale Semicond. Malaysia Sdn. Bhd., Petaling Jaya (Ibrahim, M.R.; Siong Chin Teck; Yong Cheng Choi)
Abstract	In an ultra fine pitch (UFP) wire bonding process, understanding inter-metallic growth and its effect on package reliability are challenging areas. In most cases, eventual resistive ball bond failure is a challenge to the ultra fine pitch packaging. This paper presents an innovative approach to the wire bonding process, tools and material set to enable great performance in reliability packaging. The process also introduces a new, superior 3N gold wire in order to slow down the inter-metallic (IMC) growth to prevent the resistive ball bond failure at earlier stressing stage. A series of evaluations were conducted to establish optimal wire bonding process with good package reliability on different devices. The new material set and process has been proven through production assembly over ten months without any major issues.
Starting Page	365
Ending Page	369
File Size	4931759
Page Count	5
File Format	PDF
ISBN	9781424407293
ISSN	10898190
DOI	10.1109/IEMT.2006.4456480
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-11-08
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wire Gold Bonding processes Conducting materials Assembly Electronics packaging Semiconductor device manufacture Manufacturing industries Semiconductor device packaging Materials reliability
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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