NDLI: Complex Low Volume Electronics Simulation Tool to Improve Yield and Reliability

Content Provider	IEEE Xplore Digital Library
Author	Velandia, Diana M. Segura Conway, Paul P. West, Andrew A. Whalley, David Wilson, Antony Huertas, Lina
Copyright Year	2007
Description	Author affiliation: Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Leics, LE11 3TU, United Kingdom, Tel. +44 0519 227 677 (Velandia, Diana M. Segura; Conway, Paul P.; West, Andrew A.; Whalley, David; Wilson, Antony; Huertas, Lina)
Abstract	Assembly of Printed Circuit Boards (PCB) in low volumes and a high-mix requires a level of manual intervention during product manufacture, which leads to poor first time yield and increased production costs. Failures at the component-level and failures that stem from non-component causes (i.e. system-level), such as defects in design and manufacturing, can account for this poor yield. These factors have not been incorporated in prediction models due to the fact that system-failure causes are not driven by well-characterised deterministic processes. A simulation and analysis support tool being developed that is based on a suite of interacting modular components with well defined functionalities and interfaces is presented in this paper. The CLOVES (Complex Low Volume Electronics Simulation) tool enables the characterisation and dynamic simulation of complete design; manufacturing and business processes (throughout the entire product life cycle) in terms of their propensity to create defects that could cause product failure. Details of this system and how it is being developed to fulfill changing business needs is presented in this paper. Using historical data and knowledge of previous printed circuit assemblies (PCA) design specifications and manufacturing experiences, defect and yield results can be effectively stored and re-applied for future problem solving. For example, past PCA design specifications can be used at design stage to amend designs or define process options to optimise the product yield and service reliability.
Starting Page	1
Ending Page	7
File Size	3602273
Page Count	7
File Format	PDF
ISBN	9781424413355
ISSN	10898190
DOI	10.1109/IEMT.2007.4417046
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-10-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Printed circuits Principal component analysis Circuit simulation Production Costs Predictive models Analytical models Manufacturing processes Virtual manufacturing
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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