NDLI: Application Of Ultra Low Loop gold wire bonding technique in Super Thin (Jedec Package Profile Height Sub Code “X2”) Quad Flat No Lead Package (QFN)

Content Provider	IEEE Xplore Digital Library
Author	Tan Boo Wei Wang Lei Niu, K. Lu Hai Long
Copyright Year	2008
Description	Author affiliation: Carsem Semicond. (Suzhou) Co., Ltd., Suzhou, China (Tan Boo Wei; Wang Lei; Niu, K.; Lu Hai Long)
Abstract	Quad Flat No Lead Package (QFN) with “Super Thin” package height of 0.3 to 0.4 mm (package profile height sub code “X2” per Jedec Standard) is designed with limited vertical space for wire loop height. Typical package construction consists of leadframe thickness, chip and chip attach adhesive thickness, mold (encapsulation) thickness left only 75 to 100 um (3 to 4 mils) space between chip surface and package surface which is available for wire bonding . Therefore wire bonding loop height in QFN-X2 package are typically controlled within less than 100um (4mils) as measured from chip surface to highest point of wire loop . Typically there are 3 areas to consider when developing gold wire bond techniques to achieve low loop height: 1. Stress level at the heat affected zone near wire exit above ball $(1^{st}$ bonds). 2. Consistency of wire loop height across all wires within same package. 3. Resistance to mold flow sweeping during molding (encapsulation process). There are two common wire bond techniques available to achieve wire loop height less than 100um (4mils) - bond stitch on ball (BSOB) and ultra low loop (ULL) forward bonding. This paper discusses the comparative performance and limitations of both wire bond techniques .
Starting Page	1
Ending Page	6
File Size	1392841
Page Count	6
File Format	PDF
ISBN	9781424433926
ISSN	10898190
e-ISBN	9781424433933
DOI	10.1109/IEMT.2008.5507845
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-11-04
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gold Wire Bonding Semiconductor device packaging Stress Heat transfer Shape control Encapsulation Neck Motion control
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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EFFECTS OF LOOPING FORMATION ON WIRE SWEEPING PROBLEM OF A NEWLY DEVELOPED QFN PACKAGE

EFFECTS OF USG CURRENT AND BONDING LOAD ON BONDING FORMATION IN QFN STACKED DIE PACKAGE

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Development of 0.45-mm thick ultra-thin small outline package

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Ultra low loop development

Robust loop parameters for ball neck strength enhancement [package wire bonding]

Development of 0.45 mm thick Ultra-Thin Small Outline Package (UTSOP)

Reliable ultra-low-loop bonding approach on X2/X3 thin QFN

Application Of Ultra Low Loop gold wire bonding technique in Super Thin (Jedec Package Profile Height Sub Code “X2”) Quad Flat No Lead Package (QFN)

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