NDLI: A new architecture for equipment and clusters for backend processes

Content Provider	IEEE Xplore Digital Library
Author	Lichtveld, M. van der Zon, B.
Copyright Year	2002
Description	Author affiliation: BE Semicond. Industries, Drunen, Netherlands (Lichtveld, M.; van der Zon, B.)
Abstract	For years, semiconductor backend manufacturing has shown a trend for automation and integration of processes and equipment. The goals to be achieved are well known: reduction of cycle time, WIP material handling, and improvement of equipment utilization to name a few. The challenges for equipment manufacturers and integrators are maximizing functionality and flexibility, while minimizing complexity and cost. While equipment manufacturers must deal with short time-to-market and difficulties of integrating new processes in their equipment, integrators are confronted with differences in interpretation of standards by equipment manufacturers. All these problems can be tackled by a different approach to system architecture and design. This paper presents such a new approach to system architecture and design for equipment and clusters in the semiconductor backend industry. Because no fundamental differentiation is made between process integration and equipment integration, the same generic components (mechanical, electrical and software) can be used to build-equipment or clusters. Finally, this paper shows how this system architecture can be applied in the design of standalone equipment as well as in the design of clusters.
Starting Page	398
Ending Page	402
File Size	440672
Page Count	5
File Format	PDF
ISBN	0780373014
DOI	10.1109/IEMT.2002.1032787
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-07-17
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Manufacturing automation Manufacturing processes Semiconductor device manufacture Production Electronics industry Semiconductor device packaging Packaging machines Materials handling Cost function Time to market
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

A design and manufacturing solution for high reliable non-leaded CSP's like QFN

A design and manufacturing solution for high reliable non-leaded CSP's like QFN

Pervasive integrated material handling in 300 mm semiconductor manufacturing

Small, lightweight and thin package (TQON)

Development on Semiconductor Packaging and Testing Industry in China

Automation in semiconductor manufacturing

Advanced Opportunity Cost Analysis of 3D Packaging Technologies

The Development of Semiconductor Packaging and Testing Industry of China

Interoperating Simulations of Automatic Material Handling Systems and Manufacturing Processes

A new architecture for equipment and clusters for backend processes

Similar Documents

A design and manufacturing solution for high reliable non-leaded CSP's like QFN

A design and manufacturing solution for high reliable non-leaded CSP's like QFN

Pervasive integrated material handling in 300 mm semiconductor manufacturing

Small, lightweight and thin package (TQON)

Development on Semiconductor Packaging and Testing Industry in China

Automation in semiconductor manufacturing

Advanced Opportunity Cost Analysis of 3D Packaging Technologies

The Development of Semiconductor Packaging and Testing Industry of China

Interoperating Simulations of Automatic Material Handling Systems and Manufacturing Processes

A new architecture for equipment and clusters for backend processes