NDLI: Silicon thinning and stacked packages

Content Provider	IEEE Xplore Digital Library
Author	New, D.
Copyright Year	2002
Description	Author affiliation: Disco Corp., Tokyo, Japan (New, D.)
Abstract	The market demand of mobile electronic appliances is for smaller, lightweight physical characteristics with greater functionality. This demand contributes to advances in packaging technology that require semiconductor devices to be thinner to meet size and high thermal reliability constraints. Even though the active layer of most devices amounts for only 5-10 microns (with some devices needing about 20 microns to assure functionality of the device), the current thickness for new technologies such as ICs for smart card applications are around 150 microns. Based on current developments, the thickness of thinned wafers will start to approach 50 microns in the next couple of years. Therefore, it is not surprising that silicon thinning and stress relief have become important issues in the backend and assembly areas of semiconductor component manufacturers. Disco Corporation are developing new processes and pursuing industry initiatives to provide solutions to address these issues.
Starting Page	50
Ending Page	52
File Size	190820
Page Count	3
File Format	PDF
ISBN	0780373014
DOI	10.1109/IEMT.2002.1032722
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-07-17
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Electronic packaging thermal management Semiconductor device packaging Consumer electronics Home appliances Semiconductor devices Semiconductor device reliability Smart cards Stress Assembly
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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