NDLI: Characteristics of silver-plated film on the second wire bondability

Content Provider	IEEE Xplore Digital Library
Author	Lin, T.Y. Davison, K.L. Leong, W.S. Chua, S. Robin, O. Yao, Y.F. Pan, J.S. Chai, J.W. Toh, K.C. Tjiu, W.C.
Copyright Year	2002
Description	Author affiliation: Agere Syst. Singapore Pte Ltd., Singapore (Lin, T.Y.; Davison, K.L.; Leong, W.S.; Chua, S.; Robin, O.; Yao, Y.F.)
Abstract	Strong bond between the gold wire and the silver-plated leadframe is significantly crucial for maintaining either bondability or reliability during IC (integrated circuit) manufacturing process and IC application in the fields. This study investigated the surface and grain structure of the silver-plated film on the copper leadframe in terms of surface roughness test by atomic force microscopy (AFM), thickness, hardness measurement and grain structure by transmission electron microscopy (TEM). The characteristics of the silver-plated film surface and structure, e.g., surface roughness, hardness, film thickness and grain structure impacted the bonding quality which was verified by the full factorial design of experiment (DOE) wedge pull test. Implications of AFM, TEM and DOE results showed that more smooth and softer crystal surface and fewer grain boundaries of silver-plated film provided the higher pull strength which improved the yield of wedge bondability and reliability.
Starting Page	382
Ending Page	388
File Size	530217
Page Count	7
File Format	PDF
ISBN	0780373014
DOI	10.1109/IEMT.2002.1033034
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-07-17
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wire Bonding Rough surfaces Surface roughness Application specific integrated circuits Atomic force microscopy Atomic measurements Force measurement Transmission electron microscopy US Department of Energy
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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