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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Boon Ping Gan Lai Peng Chan Turner, S.J. |
| Copyright Year | 2006 |
| Description | Author affiliation: Planning & Oper. Manage. Group, Singapore Inst. of Manuf. Technol. (Boon Ping Gan; Lai Peng Chan) |
| Abstract | To perform a high fidelity simulation study on a 300 mm wafer fabrication plant, modeling of the manufacturing process (MP) alone is not sufficient. Inclusion of the automated material handling system (AMHS) model is necessary due to the high degree of factory automation. There isn't, however, a single tool that is capable of modeling both the AMHS and MP with sufficient accuracy and granularity. A commercial simulation package such as AutoMod is usually used to model the AMHS while AutoSched AP is usually used to model the MP. These packages can be integrated using the supplied interoperation module but flexibility in optimizing the execution performance for different simulation models is lacking. In this paper, we present an approach to interoperation based on the high level architecture standard. We note that the typical characteristics of disparity in the models' time granularity and frequent model interactions are the obstacle to good execution performance |
| Starting Page | 1129 |
| Ending Page | 1135 |
| File Size | 236629 |
| Page Count | 7 |
| File Format | |
| ISBN | 1424405009 |
| DOI | 10.1109/WSC.2006.323203 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2006-12-03 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Materials handling Manufacturing processes Manufacturing automation Packaging Discrete event simulation Semiconductor device modeling Semiconductor device manufacture Middleware Computational modeling Gallium nitride |
| Content Type | Text |
| Resource Type | Article |
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